Edge Shaping Products｜FAQ | ACCRETECH

Please tell us what measures to take when cutting the power supply for a long period (when halting the equipment for around a week, for example, during year-end and New Year's holidays or summer holidays).

Turn off the equipment’s power supply.
●Contact our customer support for details.

Please tell us what measures to take when starting up power supply after its long-term (after halting the equipment for around a week, for example, during year-end and New Year's holidays or summer holidays).

After inserting the spindle air, lift the spindle arm and confirm each spindle’s shaft lightly rotates by rotating it by hand.
If the rotation is heavy, continue to rotate the spindle by hand until it rotates easily.
If the spindle is suddenly rotated without checking it, the shaft will gall and this may cause malfunction.
Turn on the equipment’s power supply and confirm that it starts up normally.
●Contact our customer support for details.

The suction pressure in the cleaning table has fallen.

Is there any clogging of the vacuum unit’s drainage line?
Are there any scratches or is there any dirt on the cleaning table?
Is the exhaust pressure of the grinding table put back in the vacuum unit?
●Check for clogging of the drainage line.
　Replace the drain filters as needed.
　Check whether there are any scratches on or adhesion of garbage or dirt to the cleaning table.
　With the wafers absorbed to the cleaning table, turn the grinding table suction on and off, and confirm whether there is any change in the cleaning table suction pressure.

The grinding table suction pressure does not rise.

Is there any clogging of the vacuum unit’s drainage line?
Are there any scratches or is there any dirt on the grinding table?
Is the exhaust pressure of the grinding table put back in the vacuum unit?
●Check for clogging of the drainage line.
　Replace the drain filters as needed.
　Check whether there are any scratches on or adhesion of garbage or dirt to the grinding table.
　With the wafers absorbed to the grinding table, turn the cleaning table suction on and off, and confirm whether there is any change in the grinding table suction pressure.

Measurement values of pre-ground wafers are abnormal.

Are the measurement centering and mastering correct?
●Perform the measurement centering and mastering again.

An eccentricity error occurs in the measurement table.

Is the measurement centering correct?
Is the position of the core misalignment sensor appropriate?
●Perform measurement centering and mastering.
　Check and adjust the core misalignment sensor.

The outer periphery or notches remain uncut.

Is the grind centering off?
Is the grinding position in the notch off?
●Perform grind centering and correction.
　Check the grind transfer X-axis precision and the turning precision.
　Adjust the notch center position (DEPTH grinding).

The shape of a notch is not stable.

Is the action of the grind Y-axis normal?
Is the precision of the grind centering repetition achieved?
●Reform the grind Y-axis looseness measurement.
　If the looseness is large, the ball screw requires replacing.
　Please contact our customer support.
　Confirm that the grind centering repetition precision is achieved, and if it is not, make an adjustment. If it is unclear how to do this, contact our customer support.

The periphery surface width is not stable.

Is the action of the grind Z-axis normal?
Have you been using the old style grind θ-axis motor for 10 years or longer?
●Check the grind Z-axis stop precision, the backlash, and the movement divergence with the command values. Please contact our customer support.
　Due to the deterioration of the grind θ-axis backup bearing, the shaft may tilt.
　We recommend upgrading to the new grind θ-axis motor. Please contact our customer support.

The wafer thickness is not stable.

Is the correction value in the caddy com’s AD check large?
●If the correction value is large, the caddy com requires replacing.
　In addition, since the caddy com is no longer produced, we recommend replacing it with the new wafer thickness sensor. Contact our customer support for details.

The measurement centering is not stable.

Is the Y-axis of the measurement arm loose?
Are the suction of the measurement arm and the suction of the measurement table normal?
Do the handover heights of the measurement arm and the measurement table match?
●If the Y-axis of the measurement arm is loose, then the LM guide requires replacing.
　The measurement arm cannot properly achieve suction, despite the sensor appearing to be on, due to clogging with garbage, etc.
　Make the wafer be absorbed to the arm, pull the wafer gently with by hand, and confirm that the suction is properly achieved.
　In addition, if the measurement table and measurement arm handover heights are misaligned, then this causes a misalignment to occur during the handover.
　Contact our customer support for details.

The grind centering is not stable.

Is the grind transfer X-axis loose?
Is the tilt of the grind transfer suction pad misaligned?
Do the handover gaps with the measurement table and the grinding table match?
●If the grind transfer’s LM guide and ball screw deteriorate, looseness results and the centering becomes unstable.
　Perform measurements of the halting precision and of the backlash value.
　In addition, if the suction pad’s tilt or the gap between the tables during handover are not appropriate, this will cause wafer misalignment.
　Contact our customer support for details.

A spindle is making an abnormal noise.

Does this change if you remove the grinding stone and chuck, and rotate the spindle?
●If the abnormal sound is present even when rotating the single spindle, the spindle requires replacing. Please contact our customer support.