Edge Grinding Machines
The requirement for the wafer quality is getting higher and the condition of wafer edge is
getting more important. The edge grinders “W-GM series” process edge grinding of
various kind of materials such as Silicon,
sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures
of silicon, compound materials and other wafer shaped materials.
Wafer edge grinding machine also draws the attention as a solution for the yield loss
due to the knife edge of device wafer in the back end process.
In the semiconductor manufacturing process, from the wafer manufacturing to
the device manufacturing, the quality improvement of wafer edge is necessary
in recent years.We make proposals that achieve the improvement of quality,
CoO and yield with our machine.
getting more important. The edge grinders “W-GM series” process edge grinding of
various kind of materials such as Silicon,
sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures
of silicon, compound materials and other wafer shaped materials.
Wafer edge grinding machine also draws the attention as a solution for the yield loss
due to the knife edge of device wafer in the back end process.
In the semiconductor manufacturing process, from the wafer manufacturing to
the device manufacturing, the quality improvement of wafer edge is necessary
in recent years.We make proposals that achieve the improvement of quality,
CoO and yield with our machine.
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