Polish Grinders｜FAQ | ACCRETECH

Please tell us what measures to take when cutting the power supply for a long period (when halting the equipment for around a week, for example, during year-end and New Year's holidays or summer holidays).

Replace the water in the slurry cycle production line.
Confirm that the spindles have stopped, then turn off the equipment’s power supply.
Cut off all utilities other than the air supply. *Do not cut off the air supply (doing so may damage the air bearings).
●Contact our customer support for details.

Please tell us what measures to take when starting up power supply after its long-term (after halting the equipment for around a week, for example, during year-end and New Year's holidays or summer holidays).

Turn on all the utilities.
Turn on the equipment’s power supply and confirm that it starts up normally.
Perform the slurry cycle.
●Contact our customer support for details.

After polishing, saw marks remain.

Is the slurry flow rate normal?
Is the nozzle position off?
Have you confirmed the pressurization of the polishing head?
Have you confirmed the squareness of the polishing head?
Do you replace the conditioning brush regularly?
●Contact our customer support for details.

There is water from a leak on the floor under the equipment.

Does a work spindle have a water leak?
Is there a water leak from the INDEX drain port?　　
Is the grinding water nozzle direction correct?
●Contact our customer support for details.

A water leak has occurred from the polishing unit.

Are water drops adhering to the R/J leak port?
●Contact our customer support for details.

Surface burn (overcurrent) has occurred during wafer grinding.

Have you changed the grinding conditions (grinding stone, recipe)?
Have you changed the flow rate or the nozzle position?
Have you changed the grinding angle?
Is the value of the electric current stable during grinding?
Is it a new device?
●Contact our customer support for details.

There is an oil leak.

Is there oil adhered to the decelerator?
●Contact our customer support.
We recommend taking the maintenance training course.

The wafer suction pressure does not rise.

Check the source pressure of the vacuum.
Check the teaching position of each St.
Check the mounting and state (cracks / chips) of the hand.
Does it occur only with specific wafers?
●Contact our customer support.
We recommend taking the maintenance training course.

A chuck table rotation error occurs.

Is the chuck actually rotating?
●Contact our customer support for details.

A grinding stone axis spindle rotation error occurs.

How many rotations does it take for the error to occur?
Are there any abnormal noises or abnormal vibrations?
●Contact our customer support for details.

A slurry flowless error occurs.

Does an alarm occur in the SSU?
●Contact our customer support for details.

The polishing rate is low.

Is the slurry flow rate normal?
Is the nozzle position off?
Have you confirmed the pressurization of the polishing head?
Have you confirmed the squareness of the polishing head?
Do you replace the conditioning brush regularly?
●Contact our customer support for details.

The equipment initialization does not complete.

Check the state of the INDEX origin sensor.
If it is dirty, then clean it.
●Contact our customer support for details.

It is not possible to measure the wafer thickness with the NCIG.

Check the NCIG light intensity.
Confirm that the recipe’s tape thickness and the actual tape thickness are appropriate.
Check the NCIG air blowing.
●Contact our customer support for details.